ESiP won the ENIAC innovation award 2013

The ENIAC Joint Undertaking took the initiative to recognize the most innovative projects by an award. The project ESiP has received this distinction at the European Nanoelectronics Forum 2013.

ESiP (Efficient Silicon Multi-Chip System-in-Package Integration) is the biggest research project in Europe to research and develop highly integrated electronic system-in-package solutions was launched in August 2010. Joining together on the ESiP project are 40 microelectronics companies and research institutions from a total of nine European countries, with the aim of making miniaturized complex microelectronics systems more reliable and testable. Under the leadership of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) the research project has run until June 2013. System-in-Package means that several different chips are embedded side by side or stacked above one another in one chip package.

Quantemol was a part of ESiP project and contributed providing simulation work for plasma processing.