Quantemol team is grateful to everyone who made it to London last Friday and participated in our workshop “Linking simulation with Experiment”. We appreciated the in-depth talks and received very insightful and positive feedback for our software from the hands-on experience in the computer class. Please see the photo-report here.

Pdf files from the workshop talks and tutorials will be uploaded to the workshop page shortly.

Quantemol-N Express demonstration video

Please see how Quantemol-N Express extra feature allows you to speed up calculation set up

Quantemol is happy to announce its third workshop “Linking Simulation and Experiment” generously sponsored by CCPQ project.

This workshop will take place on 4th April 2014 in University College London, London, UK.
The morning of the workshop is devoted to talks by friends of Quantemol and the afternoon is a hands-on experience with the Quantemol-VT (industrial plasma tool simulation) and the Quantemol-N (electron scattering simulation) software packages.

We are proud to announce the following confirmed speakers at the Quantemol Workshop 2014:

Prof. Mark Kushner, University Of Michigan
Dr. Vladimir Kolobov, CFDRC/University of Alabama at Huntsville
Dr. Daniil Marinov, Open University
Dr. Arthur Greb, York Plasma Institute
Dr. Anderson Pires Singulani, ams
Prof. Jonathan Tennyson, Quantemol/University College London

Full program with details is available in the workshop 2014 section.
The participation is free but the number of places is limited. Please register in advance using this link if you want to attend the workshop.

The ENIAC Joint Undertaking took the initiative to recognize the most innovative projects by an award. The project ESiP has received this distinction at the European Nanoelectronics Forum 2013.

ESiP (Efficient Silicon Multi-Chip System-in-Package Integration) is the biggest research project in Europe to research and develop highly integrated electronic system-in-package solutions was launched in August 2010. Joining together on the ESiP project are 40 microelectronics companies and research institutions from a total of nine European countries, with the aim of making miniaturized complex microelectronics systems more reliable and testable. Under the leadership of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) the research project has run until June 2013. System-in-Package means that several different chips are embedded side by side or stacked above one another in one chip package.

Quantemol was a part of ESiP project and contributed providing simulation work for plasma processing.