Quantemol-N Express demonstration video

Please see how Quantemol-N Express extra feature allows you to speed up calculation set up

Quantemol is happy to announce its third workshop “Linking Simulation and Experiment” generously sponsored by CCPQ project.

This workshop will take place on 4th April 2014 in University College London, London, UK.
The morning of the workshop is devoted to talks by friends of Quantemol and the afternoon is a hands-on experience with the Quantemol-VT (industrial plasma tool simulation) and the Quantemol-N (electron scattering simulation) software packages.

We are proud to announce the following confirmed speakers at the Quantemol Workshop 2014:

Prof. Mark Kushner, University Of Michigan
Dr. Vladimir Kolobov, CFDRC/University of Alabama at Huntsville
Dr. Daniil Marinov, Open University
Dr. Arthur Greb, York Plasma Institute
Dr. Anderson Pires Singulani, ams
Prof. Jonathan Tennyson, Quantemol/University College London

Full program with details is available in the workshop 2014 section.
The participation is free but the number of places is limited. Please register in advance using this link if you want to attend the workshop.

The ENIAC Joint Undertaking took the initiative to recognize the most innovative projects by an award. The project ESiP has received this distinction at the European Nanoelectronics Forum 2013.

ESiP (Efficient Silicon Multi-Chip System-in-Package Integration) is the biggest research project in Europe to research and develop highly integrated electronic system-in-package solutions was launched in August 2010. Joining together on the ESiP project are 40 microelectronics companies and research institutions from a total of nine European countries, with the aim of making miniaturized complex microelectronics systems more reliable and testable. Under the leadership of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) the research project has run until June 2013. System-in-Package means that several different chips are embedded side by side or stacked above one another in one chip package.

Quantemol was a part of ESiP project and contributed providing simulation work for plasma processing.

We are happy to announce that the largest research project in Europe for researching and developing highly integrated System-in-Package solutions, Efficient Silicon Multi-Chip System-in-Package (ESiP), has been been successfully completed! Congratulations to all partners!

Quantemol has led the UK partnership and is honored to have contributed to the collaboration and innovative spirit among 40 companies from 9 European countries.
We are looking forward to new opportunities to collaborate in the future.

Participation in the project triggered the development of our Quantemol-VT software.
More information about it and a video demo can be found here.

We will be attending the workshop “Approaches for modelling technical plasma discharges” in Braunschweig, Germany on 10 September and hope to see some of you there. The workshop takes place in the frame of the INPLAS network, and brings a unique opportunity to discuss different plasma modelling approaches presented by leading companies in the field.